Electronics Design Services
We provide electronics design services - both modules and complete devices.

Service Details
- MCU Specialization : 32-bit ARM Cortex-M
- Main MCU Models : STM32, nRF52/53, ESP32
- IoT Technologies : WiFi, LoRaWAN, NB-IoT
- Power Systems : SMPS, LDO
- Energy Management : Li-Ion/LiPo and BMS systems
- Software : KiCad
Comprehensive Embedded Systems Design: From Concept to Prototype
I specialize in comprehensive design and prototyping of electronic devices. My key advantage is a unique combination of Hardware (PCB) and Software (Firmware) engineering competencies.
The client receives from me not just a board design, but a fully integrated and operational system, which drastically shortens time-to-market and eliminates communication problems between hardware and software teams.
Main Areas of Specialization
My services are focused on delivering reliable and cost-optimized solutions that form the core of modern devices.
Advanced Microcontroller Systems: I design systems based mainly on 32-bit ARM Cortex-M microcontrollers (e.g., STM32, nRF5x, RP2040 series) and ESP32.
System-on-Module (SoM) Integration: I have experience in designing carrier boards for ready-made computing modules (SoM/CoM), which allows for rapid deployment of systems based on application processors (e.g., Raspberry Pi CM family, Toradex, Variscite) without incurring the costs of complex high-speed BGA design.
Connectivity (IoT & Industrial): I design circuits with wireless communication (Wi-Fi, LoRaWAN, NB-IoT, Cat-M) and industrial standards (Ethernet, CAN, RS485).
Power Management: I design efficient power systems, including switching power supplies (SMPS), LDO, and battery management and charging systems (BMS, Li-Ion/Li-Po).
Work Standards and Design Process
I treat every project with the highest engineering care, emphasizing quality and future deployment.
Design for Certification (DfC): My projects are created with future CE certification and RED directive in mind. I apply good design practices (including proper ground routing, power filtering, signal separation) to minimize EMI/EMC testing risks and costs.
Cost Optimization (BOM): Where possible, I use pre-certified radio modules, which drastically reduces certification testing costs and complexity. I actively select components based on availability and price.
Design for Manufacturing (DfM): I design according to industry standards to ensure smooth and repeatable mass production.
Full Transparency (KiCad): I deliver all projects in the open KiCad format. This gives you full ownership of documentation, no dependency on expensive licenses (vendor lock-in), and freedom for future project development.
Technical Capabilities and Prototyping
I offer a full range of services – from design to delivery of physically assembled and operational prototypes.
PCB Complexity: Projects with layer count from 1 to 8.
Materials: Standard FR4 laminates, specialized substrates (e.g., Rogers for RF, aluminum MCPCB for LEDs and power circuits).
Precision: Design of high-density circuits, with minimum trace/space width of 0.10 mm (4 mil).
Assembly: THT, SMD (including fine-pitch components like QFN/QFP) and BGA module integration.
Formats: Support for formats from miniature sensors to large panels (up to 670 x 600 mm).
Deliverables
Depending on the agreement, the final design package contains:
Complete KiCad source files (schematic and PCB design).
Full production documentation (Gerber files, Pick&Place assembly files, drill files).
Optimized bill of materials (BOM) ready for ordering.
Assembled and operational prototypes (with programmed firmware).
Basic software (BSP) or test firmware for hardware functional validation.