Electronics Design Services

We provide electronics design services - both modules and complete devices.

Service Details

  • MCU Specialization : 32-bit ARM Cortex-M
  • Main MCU Models : STM32, nRF52/53, ESP32
  • IoT Technologies : WiFi, LoRaWAN, NB-IoT
  • Power Systems : SMPS, LDO
  • Energy Management : Li-Ion/LiPo and BMS systems
  • Software : KiCad

Comprehensive Embedded Systems Design: From Concept to Prototype

I specialize in comprehensive design and prototyping of electronic devices. My key advantage is a unique combination of Hardware (PCB) and Software (Firmware) engineering competencies.

The client receives from me not just a board design, but a fully integrated and operational system, which drastically shortens time-to-market and eliminates communication problems between hardware and software teams.

Main Areas of Specialization

My services are focused on delivering reliable and cost-optimized solutions that form the core of modern devices.

Advanced Microcontroller Systems: I design systems based mainly on 32-bit ARM Cortex-M microcontrollers (e.g., STM32, nRF5x, RP2040 series) and ESP32.

System-on-Module (SoM) Integration: I have experience in designing carrier boards for ready-made computing modules (SoM/CoM), which allows for rapid deployment of systems based on application processors (e.g., Raspberry Pi CM family, Toradex, Variscite) without incurring the costs of complex high-speed BGA design.

Connectivity (IoT & Industrial): I design circuits with wireless communication (Wi-Fi, LoRaWAN, NB-IoT, Cat-M) and industrial standards (Ethernet, CAN, RS485).

Power Management: I design efficient power systems, including switching power supplies (SMPS), LDO, and battery management and charging systems (BMS, Li-Ion/Li-Po).

Work Standards and Design Process

I treat every project with the highest engineering care, emphasizing quality and future deployment.

Design for Certification (DfC): My projects are created with future CE certification and RED directive in mind. I apply good design practices (including proper ground routing, power filtering, signal separation) to minimize EMI/EMC testing risks and costs.

Cost Optimization (BOM): Where possible, I use pre-certified radio modules, which drastically reduces certification testing costs and complexity. I actively select components based on availability and price.

Design for Manufacturing (DfM): I design according to industry standards to ensure smooth and repeatable mass production.

Full Transparency (KiCad): I deliver all projects in the open KiCad format. This gives you full ownership of documentation, no dependency on expensive licenses (vendor lock-in), and freedom for future project development.

Technical Capabilities and Prototyping

I offer a full range of services – from design to delivery of physically assembled and operational prototypes.

PCB Complexity: Projects with layer count from 1 to 8.

Materials: Standard FR4 laminates, specialized substrates (e.g., Rogers for RF, aluminum MCPCB for LEDs and power circuits).

Precision: Design of high-density circuits, with minimum trace/space width of 0.10 mm (4 mil).

Assembly: THT, SMD (including fine-pitch components like QFN/QFP) and BGA module integration.

Formats: Support for formats from miniature sensors to large panels (up to 670 x 600 mm).

Deliverables

Depending on the agreement, the final design package contains:

Complete KiCad source files (schematic and PCB design).

Full production documentation (Gerber files, Pick&Place assembly files, drill files).

Optimized bill of materials (BOM) ready for ordering.

Assembled and operational prototypes (with programmed firmware).

Basic software (BSP) or test firmware for hardware functional validation.